Welcome to Semiconductor Wafer Bonding Laboratory HomePage
Members
Update Activities
- Application of Smart Cut in Wafer Bonding Process - (6500A SiC was transferred onto glass in the
laboratory, August 7, 1996) (Figure: Smart Cut Process)
- Application of CMP in Wafer Bonding Process
- Transfer of VLSI Device Layer on Glass - (SRAM VLSI device layer was transferred onto glass in the
laboratory, July 15 , 1996) (Figure: Photo of SEM )
- Low Vacuum Wafer Bonding
- Etching Bonded Pairs of Low Bonding Strength
- Curved Wafer Bonding
- Superconductor Bonding
- Bubble Free Wafer Bonding
Publications
Current Collaborations & Sponsors
- Max-Planck Institute of Microstructure Physics, Germany.
- Shin-Etsu Handotai Co., Ltd., Japan
- Vacuum Research Corporation, PA
- BEI Sensors and Systems Co., CA
- Chalmers University of Technology, Sweden
- The Hong Kong University of Science & Technology, Hong Kong
- Argonne National Lab., IL
- Brookhaven National Lab., NY
- AT&T, PA
- Microelectronic Center of North Carolina, NC
